Heat spreader and semiconductor package compring the same

PURPOSE: A heat spreader and a semiconductor package including the same are provided to protect a heat dissipation layer from an external shock or a foreign material which are generated in processes by forming a bonding layer at the upper part of the heat dissipation layer. CONSTITUTION: A heat dissipation layer(10) is formed on the upper part of a first adhesive layer(20). The first adhesive layer has conductivity and elasticity. A vent part(30) is formed passing through the first adhesive layer and the heat dissipation layer. A second adhesive layer(40) is formed on the upper part of the heat dissipation layer. A protective layer(50) is formed on the upper part of the second adhesive layer.