Resin molding and the conductive resin composition

Polyamides composed of two or more different polyamide component (A), polyphenylene ether (B) and the aromatic vinyl polymer block and partially hydrogenated block obtained by partial hydrogenation of the conjugated diene polymer block comprising a block copolymer copolymer (C) (number average molecular weight comprising a copolymer (C-1) of 200,000～300,000) a, (a) forms a continuous phase, (B) is the continuous phase the dispersed phase is formed in, (C) is present in the dispersed phase of the (a) the continuous phase and / or (B), the surface area of ​​the are exposed on the surface of the molded body (a) is the resin molded body characterized by at least 80% relative to the total surface area of ​​the shaped body. Polyamide (A), polyphenylene ether (B), the block copolymer comprising an aromatic vinyl polymer block and a conjugated diene polymer block (C), a conductive carbon material (D) and wollastonite particles (E) conductive resin composition comprising.