A composite packaging structure and a method of preparing a microwave induction

The present invention relates to a composite packaging structure and a preparation method for a microwave oven microwave sensing. The microwave induction composite packaging structure, characterized in that a composite of the paper layer, an adhesive layer and a sensing layer formed by the microwave, the planar plate having different deployment performance sensing region. Preparing a composite microwave sensor package structure, the process comprising: Plate Design - hollow Plating - compound. The present invention can effectively solve the problem of performance single active microwave sensor structure in microwave food packaging, according to the structure, composition, and heating a food to design hollow plating, vapor deposition to obtain a packaging material having a different microwave effects, improve production efficiency and reduce Cost of production. While addressing the need to use conventional microwave sensitive material printing chemical etching of pollution from the production of special shape.