end-scribe front of light emitting diodes (LED; light emitting diode) wafers and resulting device

A wafer for light emitting diodes (LEDs) is scribed with the laser to produce a laser-scribe section. Then, the wafer is cleaned, for example. For example, by wet etching to reduce the scribe damage. Then, electric contact layers for the LEDs on the cleaned wafers to be formed. Optionally, the scribe section can be produced by multiple etching prior to contact formation. Related LEDs are also described.