A method for bonding substrates with polyurethane adhesives

The invention relates to a method for bonding substrates with different surface energy, characterized in that the adhesive used for bonding comprises at least 15 wt .-% of a polyurethane (water or other organic solvents having a boiling point below 150 ° C at 1 bar not included in the calculation), the adhesive on the substrate having the lower surface energy is applied, and the resulting adhesive coated substrate is bonded to the substrate having the higher surface energy.