A method of fabricating an integrated circuit leadless housing and integrated circuit leadless housing

A method of fabricating an integrated comprising the steps of leadless housing circuit: - providing a leadframe frame (1) having a top and a bottom and at least one lead frame portion (2, 3, 4, 5) which is provided surrounded with one of a plastic housing (6) semiconductor device, wherein as conductor tracks (7 ) formed on areas of the lead frame portion (2, 3, 4, 5) penetrate an outer surface of the plastic housing (6), wherein, before a step of severing the conductors (7) for singulating an integrated circuit, the following step is provided: - applying at least a transition area between the plastic housing (6) and conductor tracks (7) with high-energy radiation from the top and bottom of the lead frame the frame in such a manner that parts of the plastic housing (6) are removed in the transition region, - severing the conductor tracks (7) for singulating the integrated leadless housing circuit to generate at separating surfaces (10), so that between each separation surface (10) and a portion of the interface in question (10) surrounding plastic housing (6) in plan view ...