The study of Nano anchoring copper foil for PWB

A newly developed copper foil which is chemically processed has been introduced as nano anchoring copper foil for Printed Wiring Board (PWB). This treatment technology enables good adhesion even on the nano-scale surface roughness by conditioning a copper surface of nano-scale anchoring structure. The surface roughness of the copper foil affects fine patterning capability and transmission loss. Fine patterning capability by subtractive process has been demonstrated by using a nano anchoring copper foil. There is possibility to have 20–25 μm trace. It was also confirmed that the transmission loss is lowered when using nano anchoring copper foil. It was suggested that the surface roughness of the copper foil has a larger influence on the transmission loss as the high frequency.