Advanced multi-sites testing methodology after wafer singulation for WLPs process

With the strong grow of smartphone, wearable devices and the upcoming IoT in our life. Wafer level packages offer the lowest total cost of higher semiconductor content with leveraging the smallest die size and the highest performing, most reliable on the market today. The existing testing process of WLPs encounter the new challenges from thinner and warpage wafers which will impact high parallelism multi-sites testing performance and KGDs of wafer singulation.