Structure material in a scribe line and method for separating chips

It is disclosed a method of manufacturing a chip (310). The method includes forming a material structure (330) in a scribe line (320) which is adjacent to the chip (310) on a wafer (300) on. The method further comprises the selective removal of the material structure (330) in the scribe line (320) and the separation of the wafer (300) into chips (310). There is further disclosed a semiconductor wafer (300). The semiconductor wafer (300) comprises a plurality of chips (310) and a plurality of scribe lines (320). The scribe lines (320) separate the chips (310) from each other. At least one scribe line (320) includes a scribe-line framing (330). The scribe-line framing (330) is one side of the at least one chip (310) located immediately adjacent.