The effect of additives on the structure and differential double-layer capacitance of electroplated copper

R. Weil,Jei-Wei Chang

The effect of additives on the structure and differential double-layer capacitance of electroplated copper

1988

R. Weil
Jei-Wei Chang

Etude de l'influence de trois additifs ajoutes a la solution acide, sur la microstructure des depots electrolytiques de cuivre et la capacitance differentielle

Keywords:

Electroplating
Inorganic chemistry
Metallurgy
Microstructure
Chemistry
Copper
Capacitance
Double-layer capacitance

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