Condensation reaction-type die bonding agent, led light emitting device and method for manufacturing same

Provided is an LED light emitting device which has less possibility of the occurrence of conduction failure at an electrode. This die bonding agent is a condensation reaction-type adhesive for bonding an LED element that has a connection surface covered with gold; and this die bonding agent contains (A) a polysilsesquioxane which contains a trisiloxy unit (T A ) represented by R 1 SiO 3/2 (wherein R 1 represents one group selected from the group consisting of an alkyl group having 1-15 carbon atoms, a phenyl group and a benzyl group) and a hydroxyl group, and which is in a solid state at room temperature, (B) a polysilsesquioxane which contains a trisiloxy unit (T B ) represented by R 2 SiO 3/2 (wherein R 2 represents one group selected from the group consisting of an alkyl group having 1-15 carbon atoms, a phenyl group and a benzyl group) and an -OR 2 group (wherein R 2 represents one group selected from the group consisting of an alkyl group having 1-15 carbon atoms, a phenyl group and a benzyl group), and which is in a liquid state at room temperature, and (C) a condensation reaction catalyst.