Wire electric discharge machining apparatus and method for manufacturing a semiconductor wafer using the same

The cutting and finishing, in order to obtain a wire electric discharge machining apparatus that can be performed by batch processing in the same apparatus, a plurality of main guide rollers arranged in parallel at intervals (1a) ~ (1d) a plurality of main guide rollers (1a) ~ (1d) is wound spaced apart at a constant pitch between a pair of guide rollers (1a), a main guide forming the cutting wires (CL) between (1b) a single wire which runs with the rotation of the roller (1) (3), the cutting wires and the feeder units for supplying power to each of the wires (3) of (CL) (6), a wire electric discharge machining having a an apparatus, disconnects the workpiece (5) by the cutting wires (CL), with a partially led workpiece (5), cut out of the semiconductor wafer from the workpiece (5) interrupted, cutting wires (C ) Of the wire (3) is close to one of the cut surface has a configuration for scanning the discharge machining state by.