Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing processing material for semiconductor, and semiconductor device

A semiconductor film composition, containing: a compound (A) having an Si-O bond and a cationic functional group including at least one of a primary nitrogen atom and a secondary nitrogen atom; a crosslinking agent (B) having a weight average molecular weight of 200-600 and having three or more -C(=O)OX groups (where X is a hydrogen atom or a C1-6 alkyl group) in the molecule, one to six of the three or more -C(=O)OX groups being a -C(=O)OH group; and a polar solvent (D).