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PCB development using HDI-technology and 3D-mounting of chips for MPGD readout
PCB development using HDI-technology and 3D-mounting of chips for MPGD readout
2019
Leif J. Jönsson
Oxana Smirnova
Björn Lundberg
Ulf Mjörnmark
Lennart Österman
Anders Nils Erik Oskarsson
Keywords:
Optoelectronics
Materials science
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