Investigation of low-temperature sintering of silver paste

Investigations were carried out into thermal effects taking place during drying and sintering of a silver-containing paste used for the production of low-temperature joints in the ‘silicon on molybdenum’ system for semiconductor devices. The change of the shape and dimensions of the silver particles during drying of the silver-containing paste at different temperatures is studied. The microhardness of the sintered layers, produced in different conditions, is determined.