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Reliability Study and Failure Analysis for Surface Finishes on Sn–Ag–Cu Solder Joints During Thermal Cycling
Reliability Study and Failure Analysis for Surface Finishes on Sn–Ag–Cu Solder Joints During Thermal Cycling
2016
Chaobo Shen
Zhou Hai
Cong Zhao
Jiawei Zhang
John L. Evans
M.J. Bozack
Jeffrey C. Suhling
Keywords:
Soldering
Surface finish
Temperature cycling
Composite material
Materials science
reliability study
Correction
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