Effect of Sintering Control on Shrinkage Suppressor of Ni Internal Electrode Paste Film by MLC

The addition of sintering suppressor to Ni paste was studied in order to enable further thinning of the MLC Ni electrode. The contraction rate of the Ni paste without the sintering suppressor increased as the paste grain diameter decreased. A considerable difference was observed between the sintering contraction rate of a dielectric green sheet and that of Ni paste. This finding led us to consider that the sintering contraction behavior of Ni paste should be close to that of the dielectric green sheet in the manufacturing process of current ceramic capacitors. Therefore, we studied an organometallic acid salt with the same composition as the ceramic. According to the results of our study, sintering of electrode paste film was inhibited when using Ni paste with an organometallic acid salt in contrast to the case of using Ni paste without an organometallic acid salt. Furthermore, the study of resistivity to determine the electrical characteristics revealed that the Ni paste film with the sintering suppressor exhibited low resistivity compared to the Ni paste film without the sintering suppressor. It was clarified that Ni paste with a sintering suppressor has excellent electrical characteristics.