Applicable Superamphiphobic Ni/Cu Surface with High Liquid Repellency Enabled by the Electrochemical-Deposited Dual-Scale Structure

Until now, scalable fabrication and utilization of superamphiphobic surfaces based on sophisticated structures has remained challenging. Herein, we develop an applicable superamphiphobic surface with nano-Ni pyramid/micro-Cu cone structures prepared by cost-effective electrochemical deposition. More importantly, excellent dynamic wettability is achieved, exhibiting as ultralow sliding angle (∼0°), multiple droplets rebounding (13 times), and a total rejection. The supportive cushions trapped within the dual-scale micro/nanostructures is proved to be the key factor contributing to such high liquid repellency, whose existence is intuitively ascertained at both solid–air–liquid and water–solid–oil systems in this work. In addition, the enduring reliability of the wetting performance under various harsh conditions further endows the surface with broader application prospects.