Method for manufacturing semiconductor chips and surface protective tape for thin-film grinding used in same

[Problem] To provide a high precision and simple method for manufacturing semiconductor chips in semiconductor chip manufacturing that carries out back surface grinding of a semiconductor wafer which is used in a flip chip mounting process and has bump electrodes and simultaneously or in a process thereafter carries out chip formation without using underfilling, and also to provide a surface protective tape for thin-film grinding used in that method. [Solution] This manufacturing method for semiconductor chips grinds the back surface of a semiconductor wafer after formation of a modified layer within a wafer with bump electrodes, which has bumps for electrodes, on the semiconductor wafer on which a semiconductor circuit has been formed, and carries out division into individual chips in a batch. This method for manufacturing semiconductor chips has a step for applying surface protective tape for thin-film grinding in which a bonding film is laminated on an adhesive layer in an adhesive tape that has an adhesive layer on a base material film to the side of a semiconductor wafer on which a semiconductor circuit is formed on the bonding film side after formation of the modified layer and before the back surface of the semiconductor wafer is ground, and a step for creating a state in which only the bonding film bonds to the chips when the chips are picked up after back surface grinding of the semiconductor wafer or when transferred to a tape used for pick-up. The surface protective tape for thin-film grinding used therein is also provided.