Mechanical properties of a novel multi-scale silver paste for electronics interconnect application

A novel nano-silver paste with characteristics of sintering at low temperature and operating at high temperature is one of the most promising interconnect materials in the semiconductor industry. This study focuses on the shear strength of sintered multi-scale silver paste synthesized by nano-silver particles, micro-silver particles and submicron silicon carbide particles coated with Ag (SCA). The silver paste was sintered at 250 °C without pressure. The shear strength reaches 9.22 MPa, with 64 wt.% nano-silver particles, 16.5 wt.% micro-silver particles and 1.5 wt.% SCA, respectively. With this, it shows great potential for high power electronics interconnect and cooing applications.