Marking position correcting apparatus and method

The present invention relates to a marking position correcting apparatus and a marking position correcting method, which are capable of marking at a correct position on semiconductor chips during a marking operation, by measuring and correcting a position to be marked using a processing film for position correction before performing the marking operation on the semiconductor chips provided on a wafer. A marking position correcting apparatus according to one embodiment of the present invention relates to a marking position correcting apparatus for correcting a marking position of a wafer, comprising: a support for supporting a processing film for position correction; a laser head for irradiating a laser beam onto the processing film for position correction to form a pattern; a vision camera for obtaining position information of the pattern; a moving table for moving the support in a horizontal direction; and a control unit for comparing and matching the position information of the pattern with marking position information set in the laser head.