Film seal cap packaging structure for MEMS (micro electro mechanical system) optical device and manufacturing method of film seal cap packaging structure

The invention relates to a film seal cap packaging structure and a manufacturing method of the film seal cap packaging structure, in particular to the film seal cap packaging structure for an MEMS (micro electro mechanical system) optical device and the manufacturing method of the film seal cap packaging structure. Specifically, the prepared film seal cap can meet the requirements of wafer and chip packaging and belongs to the technical field of MEMS packaging. According to the technical scheme provided by the invention, the film seal cap packaging structure comprises a substrate and an MEMS optical structure located on the substrate, wherein the film seal cap is arranged on the substrate; the edge at the end of the film seal cap is fixedly connected with the substrate through a bonding layer in a bonded way; a cavity for receiving the MEMS optical structure is formed between the film seal cap and the substrate; and the MEMS optical structure is located in the cavity. The film seal cap packaging structure provided by the invention is compact in structure, convenient to manufacture, low in manufacturing cost, good in airtightness, wide in application range, safe and reliable.