Thermal Resistance Model and Analysis for Future Smart Glasses

This paper presents a thermal network model in a steady state condition for thermal management of future smart glasses. It is accomplished by disassembling the state wearing smart glasses into some parts, creating the equivalent thermal resistance circuit for each part, approximating heat generating components such as ICs to simple physical structures, setting power consumption to the heat sources, and providing heat transfer coefficients of natural convection in air. The average temperature difference between the thermal network model and a commercial thermal solver is 0.9°C when the maximum temperature is 62°C. Moreover, the thermal analysis results using the model reveal some important points for thermal design of smart glasses.