Epoxy encapsulants for a composite insulator and method of preparation

The present invention relates to an epoxy resin potting technology, and particularly relates to an epoxy resin potting and preparation method for the composite insulator, wherein the formulation is 95 parts by mass to 105 parts epoxy resin, 0.5 ~ 1.5 parts of a curing accelerator, 5 to 30 parts of white carbon, 5 to 30 parts of ultrafine aluminum powder is made. Compared with the prior art, the present invention has excellent mechanical strength and electrical performance, smaller shrinkage, improved adhesiveness epoxy potting and sealing, the connection between the mandrel and the flange stronger , in the long-term strong electric field intensity, to meet the requirements of high voltage and extend the life of the epoxy resin potting present invention is particularly suitable for composite insulators encapsulation process connection flange.