Tape film package and manufacturing method of the same

PURPOSE: Tape film package and manufacturing method thereof are provided to increase the production yield by preventing or minimizing generation of metal particles. CONSTITUTION: A via contact (40) penetrates an insulation film (10). First wire patterns (30) are extended from the via contact to a cross section of the insulation film. Second wire patterns (50) are connected to the via contact below the insulation film, are parallel with the first wire patterns and are spaced apart from the cross section of the insulation film. A second solder resist (52) covers a part of the second wire patterns. The second solder resist is arranged below the insulation film between the second wire patterns and cross section.