Design and Implementation of a Compact Dual-band RF System-in-Package Module

This paper presents design and implementation of a compact dual-band RF system-in-package (SiP) module for radar applications. Four S-band transceivers and one P-band transceiver are integrated in this module to realize four-channel radar front end integration. Multi-layer High-Temperature Co-fired Ceramic (HTCC) substrate with metal enclosure on the top side and Ball Grid Array (BGA) on the bottom side is adopted to achieve high RF performance and reliability. With 13 active chips and 50 passive components integrated in the HTCC substrate, the SiP achieves a compact size of 20×25×4.6 mm3 and a small weight of 7g. Design techniques of metal crossers, via barriers and coaxial-via structures are introduced to improve channel-to-channel isolation to 120 dB in S-band. The simulated results show that the SIP achieves low DC voltage drop and good thermal performance.