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D013 Development of a structure with variable thermal conductivity using an electro-adhesive gel
D013 Development of a structure with variable thermal conductivity using an electro-adhesive gel
2013
Kunito Konishi
Tojiro Aoyama
Hidenobu Anzai
Hiroharu Sakurai
Keywords:
Semiconductor device fabrication
Thermal contact conductance
Thermal insulation
Thermal conductivity
Adhesive
R-value (insulation)
Thermal effusivity
Composite material
Materials science
Thermal resistance
Correction
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