Three‐dimensional integration of resonant tunneling structures for signal processing and three‐state logic

We have developed structures with two well‐defined negative differential resistance (NDR) regions by sequentially growing two resonant tunneling devices separated by an n+ connecting layer. Devices fabricated from these structures exhibited three stable operating points for multilevel logic circuits and were used in circuits which multiplied the input signal frequency by 3 or 5. This approach can be extended to obtain more than two NDR regions by vertical integration of additional resonant tunneling structures.