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Evaluation of Power Dissipation and Delay for New TSV Design Based on Cu/Sn to BCB Hybrid Bonding
Evaluation of Power Dissipation and Delay for New TSV Design Based on Cu/Sn to BCB Hybrid Bonding
2013
Y-J. Chang
C-T Ko
Z.C. Hsiao
H.C. Fu
T. H. Yu
W-C Lo
K-N Chen
Keywords:
Dissipation
Materials science
Electronic engineering
Optoelectronics
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