Cooling system and small-sized electronic equipment

PURPOSE: To provide a cooling system which can reduce the interval between substrates and the size of electronic equipment even when the system is used for air-cooling the electronic equipment. CONSTITUTION: In the title cooling system which cools electronic equipment having a plurality of substrates 11 mounted with semiconductor elements 12, heat pipes 13 respectively enclosing a coolant and provided with heat radiating sections 17 on one end sides are arranged between each substrate 11 in such a state where the pipes 13 are thermally brought into contact with the elements 12 or substrates in a laminated state. COPYRIGHT: (C)1993,JPO&Japio