Bonding material, and method of manufacturing electronic components, and electronic device

Land electrodes 1a, and the printed circuit board 2 having a 1b, external electrodes 4a on the surface of the component body 3, 4b has a chip-type electronic component 5 formed, the land electrodes 1a, 1b and the external electrodes 4a, and 4b There are joined through the solder 6, the electrode joint 7a, and 7b are formed, the electrode joint 7a, the inter 7b thermosetting resin 8 is filled. Bonding material, the solder particles having a melting point T1, and a thermosetting resin having a higher curing temperature than the melting point T1, contains an active agent having low activation temperature T3 than the curing temperature T2, the solder particles in the melting point T1 the viscosity of containing components excluding is not more than 0.57Pa · s, a melting point T1 and activation temperature T3 is, which satisfies the T1-T3 <50. Thereby the mechanical strength good electrical connection and insulation reliability satisfactory electronic devices, bonding materials suitable for making the electronic device, to realize a method of manufacturing an electronic apparatus using the bonding material.