Mems module package

The present invention relates to relates to a MEMS package, in particular the structure of the MEMS package. According to an aspect of the invention, the lower substrate; An optical modulator which is positioned on the lower substrate, transmitted by modulating an optical signal through the lower substrate; In order to drive the optical modulator driver IC to be mounted around the optical modulator; A wiring circuit formed on the lower substrate to transfer the signal for driving the light modulator; And opposite the lower substrate disposed on the light modulator, and the driver IC, and is provided an optical modulator module package comprising a printed circuit board for the signal connection to the external circuit. MEMS module package according to the present invention has the effect of reducing the overall size by varying the inter-layer configuration. MEMS, an optical modulator, and the printed circuit board, the cap, the driver IC.