Light emitting diode with flip chip
2011
The utility model relates to the technology of luminescent device, specifically to a light emitting diode with a flip chip. The light emitting diode with the flip chip provided by the utility model comprises a light emitting diode chip and a flip substrate. Anisotropy conductive glue is arranged between the light emitting diode chip and the flip substrate. The light emitting diode chip is inverted and fixed on the flip substrate through the anisotropy conductive glue. The utility model can invert and fix the light emitting diode chip on the flip substrate through the anisotropy conductive glue without ultrasonic welding, expensive gold or expensive and complicated ultrasonic inverting table. Therefore, the light emitting diode with a flip chip of the utility model is featured with low production cost, low reject ratio of production and simple process.
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