Resin composition and a prepreg made therefrom, the printed circuit board

A resin composition comprising an epoxy resin, a hardener, and a modifier, wherein the modifier is a polymer solution, prepared by the following steps: (a) the heterocyclic compound dissolved nitric oxide in a first solvent to form a first reaction solution, the nitrogen heterocyclic compound is an oxide having the formula I or II; [formula I] [formula II] wherein, Rl to R3, W1, W2, m, n, p and q are as defined herein; (b) heating the first solution to a first reaction temperature to effect the ring opening polymerization, provide a ring-opening polymerization product solution; and (c) cooling the ring-opening polymerization product solution to a second temperature to substantially terminate the ring-opening polymerization reaction, the polymer solution, wherein the first solvent is non-reactive with the nitroxide heterocyclic compound; the first temperature is above the nitroxide heterocyclic compound and a softening temperature below the boiling point of the first solvent; and the second temperature is lower than the first temperature, wherein the content of the curing agent is about 1 part by weight per 100 parts by weight of epoxy resin to about 100 parts by weight, and a solid content (i.e., excluding the weight of solvent) content of the modifier per 100 weight An amount of from about 0.5 parts by weight epoxy resin to 20 parts by weight.