Surface treated copper foil and laminate using the same printed wiring board, electronic apparatus, and method for manufacturing a printed wiring board

A good adhesion with the resin, and provides a surface treated copper foil and laminates using the same excellent transparency of the resin after the removal of the copper foil by etching. A roughening particles by roughening at least one of the copper foil surface is formed, for the roughening particles of roughening the surface, a major axis 50 per roughening particles per unit area is 100nm or less / [mu] m are formed .FIELD 1