Plasma processing equipment having improved vacuum pressure control apparatus
2002
Plasma processing equipment includes a process, a cover covering the top of the process chamber, a wafer chuck disposed in the process chamber, a pressure regulating system including a pressure regulating plate situated at the bottom surface of the cover, and an elevating mechanism for adjusting the position of the pressure regulating plate, and a measuring device including at least one visual display for use in calibrating the pressure regulating system.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI