Leadless package type power semiconductor module

The present invention relates to a power semiconductor module. The power semiconductor module according to one embodiment of the present invention is connected via a surface-mounted system connector, the connection terminal to the connecting portion formed on the corner meet each of the slope variations are arranged in the center, the power semiconductor element or the power semiconductor element and is electrically connected to and disposed between them control the first mounting region and the connection terminal to which the control element is mounted to, and a second mounting area on which the power semiconductor element or the control element is mounted, wherein the first mounting area is the 2 via the connecting portion to generate the mounting area and the phase difference are arranged in the second mounting region and a different height. As a result, one-dimensional high-integration, high performance, miniaturization of the power semiconductor module by application of the three-dimensional structure in which the planar structure can be peeled.