A process for recontacting in ceramic components

The invention relates to a method for manufacturing an electrical component, in particular a ceramic sensor element (110). The electrical component has a layer structure with at least one substrate (126) and at least one structure (128) for an electric circuit (118). The structure (128) is disposed substantially on a first side (130) of the substrate (126). To contact the structure (128), at least one connection region (138) of the structure (128) in at least one Umkontaktierungsschritt in at least one Umkontaktierungsbereich (142) to an edge portion (134) of the substrate (126) around the first at least one second, by the side (130) different side (132) of the substrate (126) performed. On the second side (132) is formed at least one contact region (144) for contacting the electrical circuit (118).