Finite Element Analysis of Pixel Structure of Uncooled Microbolometer for Food Operation Environment

Uncooled infrared bolometer arrays have become mainstream low-cost thermal detector used in applications such as firefighting, security and surveillance, and environment temperature control for food operation. In order to resolve the pixel structure’s stress problem of microbolometer, this paper adopts finite element analysis method to model and analyze the mechanical properties of pixel structure. Several results of the stress and displacement are presented and the influence of structure optimization on the stress is also analyzed quantitatively. The research provides a good foundation and mechanics reference for mechanical design of uncooled microbolometer.