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Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation
Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation
2021
Guoyi Li
Hyunseong Lee
Aditi Chattopadhyay
Rajesh Kumar Neerukatti
Kuang C. Liu
Keywords:
Sealant
Integrated circuit
Composite material
Nondestructive testing
Delamination
Materials science
Correction
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