MEMS structures and methods of forming mems

The present invention discloses a device, said device comprising a substrate and a lid substrate bonded to the structure. The substrate structure comprises an integrated circuit structure. The integrated circuit structure comprising a gas escape preventing disposed on the top metal layer structure. At least one MEMS device is disposed in the top metal layer and the upper structure to prevent gas from escaping. The present invention also discloses a microelectromechanical system (MEMS) structure and a method of forming a MEMS structure.