The method of manufacturing a package, a package, a piezoelectric vibrator, an oscillator, an electronic device and a radio-controlled timepiece

The present invention provides a method of manufacturing can be a desired shape of the substrate thermoformed package, the package member, a piezoelectric vibrator, an oscillator, an electronic device and a radio clock. The present invention is characterized in that: in the molding step is a step of forming a through hole, the through hole having formed (30, 31) of the through-hole corresponding to the convex portion (53) of the mold (51) pressing the base substrate wafer (41 ), and the step of forming a through hole (30, 31) by heating, the through hole forming mold (51) more than 14% of the open porosity of the material by the configuration.