Old Web
English
Sign In
Acemap
>
Paper
>
Static analysis of bond between prestressing strand and UHPC exposed to elevated temperatures
Static analysis of bond between prestressing strand and UHPC exposed to elevated temperatures
2021
David Čítek
Jindřich Čech
Petr Pokorný
Jiří Kolísko
Keywords:
Bond
Static analysis
Composite material
Materials science
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]