The photosensitive resin composition, manufacturing method and the electronic components of the pattern cured film

And (A) an alkali-soluble resin, containing (B) a compound generating an acid by light, and (C) a thermal crosslinking agent, and a nitrogen-containing aromatic compound represented by (D) the following general formula (1) the photosensitive resin composition. Wherein, R1 represents a hydrogen atom or a hydrocarbon group, R2 is a hydrogen atom, an amino group or a phenyl group, A and B each independently a nitrogen atom or a carbon atom and hydrogen atom bonded to this show. ]