Wire cutting machine capable of pouring bonding agent

The invention relates to equipment in the technical field of machining and production of crystal grains, in particular to a wire cutting machine capable of pouring a bonding agent. The wire cutting machine comprises a wire cutting machine body, wherein the wire cutting machine body is provided with a frame; a high-frequency power supply is arranged on the frame; cutting wires are vertically arranged on the frame in the vertical direction; an adhesive groove is further formed in the frame; an adhesive groove opening passing through a conduit is formed below the adhesive groove; the adhesive groove opening is positioned in the back part of the cutting wires; a hot air blowing device is further arranged on the frame; the hot air blowing device is opposite to the cutting wires in the transverse direction; the back part of the cutting wires is consistent with the advancing direction of the cutting wires; a rotary frame is further arranged on the frame; the rotary frame can rotate by 90 degrees in the horizontal direction; the conduit is arranged on the rotary frame. The wire cutting machine has the advantages of capability of casting the bonding agent, further guarantee of the product quality and convenience in use.