Insualtion resin composition for multi-layer printed circuit board

The present invention provides an adhesive strength can be ensured and the conductor layer, the insulating resin composition can satisfy heat resistance and electrically insulating properties required of a multilayer printed circuit board. In order to process the plasma obtained uneven shape on the surface of the insulating layer, the insulating resin composition as a multilayer printed circuit board, the insulating layer 15 is determined to contain a different etching rate of plasma processing and mutually immiscible two or more thereof resin. Accordingly, the adhesive strength can be ensured and the conductor layers satisfy the heat resistance and electrical insulating properties.