Semiconductor device, manufacturing method, and the adhesive layer-attached semiconductor wafer of a semiconductor device

A circuit surface of a semiconductor wafer and forming an adhesive layer by forming the adhesive composition on the opposite surface comprises a step of B-staging by light irradiation of the adhesive layer, a semiconductor wafer, B bonding a step of carving a plurality of semiconductor chips by cutting together with the adhesive layer which is staged, the semiconductor chip and the supporting member or another semiconductor chip, by crimping across the adhesive layer therebetween the method of manufacturing a semiconductor device comprising the steps, a.