High reliability interconnection technology using conductive adhesive

A high reliability interconnection technology using conductive adhesive is presented. Conductive adhesive interconnection technology has advantages such as environment friendly, flexible structure and low temperature processing compared with conventional solder interconnection technology, but has some matters to be solved. The authors have been developing the technology on the point of above mentioned. The first targets are developments of the interconnection reliability and manufacturing process. Improvements of the reliability were conducted with a new conductive adhesive and a surface treatment technology. The connection resistance change between solder plated electrode resister and Au flashed electrode substrate was within 10% during 1000hrs in 358K and 85% RH atmosphere test with new conductive adhesive, while the change was more than several times for conventional conductive adhesive. The new conductive adhesive is composed by spherical and flake Ag filler. The change was within 15% during 84hrs in 313K and 90% RH with 3ppm H2S atmosphere test by new surface treatment technology using coating agent on the cured conductive adhesive. The anti-migration test between conductive adhesive formed on parallel electrodes was demonstrated. The electrical resistance was constant during 1000hr for the surface treated vehicle, while the resistance decreased radically for the vehicle without the treatment.