Thermal Stress Simulation Analysis of LGA Power Module Package

The power module based on LGA package has many structural and performance advantages such as miniaturization, high heat dissipation, low impedance, etc., which is well in line with the development trend of electronic packaging toward miniaturization and high performance. This article has carried out strict requirements on power modules Mechanical and thermal simulation analysis to study the impact of different packaging structures on the micro-bumps in the power module and the heat dissipation performance of the package. Identify potential risk points before product manufacturing to improve product reliability, reduce development costs, and shorten development cycles .