Technology development for micromirror arrays with high optical fill factor and stable analogue deflection integrated on CMOS substrates
2008
At Fraunhofer IPMS Dresden micromechanical mirror arrays are developed and fabricated using a high-voltage CMOS
process for applications such as lithographic mask writers and adaptive optics. Different approaches for the fabrication of
micromechanical mirror arrays with up to 1 million analogue addressable pixels in a MEMS-on-CMOS technology are
discussed: sacrificial layer technologies of 1-level actuators made from a single Al-TiAl-Al structural multilayer or 2-level actuators with an additional TiAl hinge layer respectively. Also the fabrication of single crystalline Si micro-mirrors
using layer-transfer bonding is discussed.
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